Cu-DLP | CW023A Material Datasheet
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Material Number | Material Number (single) | Standard | Range of Application | Standard Status | Country | Remark |
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CW023A (DIN EN 12163 : 1998-04) | CW023A | DIN EN 12163 : 1998-04 | DIN EN 12163 : 1998-04 replaced by DIN EN 12163 : 2011-08 | Replaced | Germany | Cu-DLP, mat. No CW023A, is a deoxidized copper with limited, low residual copper-content. To the comparable DIN-make SW-Cu, mat. No 2.0076 acc. to DIN 1787 : 1973-01 applies: Tensile strength and Brinell hardness are increasable by cold forming. SW-Cu is hydrogen resistant and shows the lowest thermal and electrical conductivity of the pure copper materials. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: very good soft soldering: very good gas-shielded welding: good burnishing: very good Application: Preferably in apparatus engineering and construction trade. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5) |
Chemical Composition
Bi [%] | Cu [%] | P [%] | Pb [%] | Source | Remark |
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Mechanical Properties
Semi-finished Product | Condition | Strength Abbrevation | Nominal Size [mm] | Temperature [°C] | Tensile Strength [MPa] | Yield Strength (0.2% offset) [MPa] | Elongation A10 [%] | Elongation A100 [%] | Elongation A [%] | Hardness HB | HBW | Hardness HV | Source | Remark |
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Physical Properties
Temperature [°C] | Melting Temperature [°C] | Density [g/cm³] | Young's Modulus [GPa] | Thermal Conductivity [W/(m*K)] | Specific Electrical Resistance [µΩm] | Mean Specific Heat Capacity [kJ/(kg*K)] | Electric Conductivity [MS/m] | Source | Remark |
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Young's Modulus [GPa] vs Temperature [°C]
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Heat Treatment | Temperature [°C] | Source | Remark |
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Cross Reference
Material Name | Country | Standard |
---|---|---|
Cu-DLP | Europe | EN 12163 |
Cu-DLP | Europe | EN 12167 |
Cu-DLP | Europe | EN 1653 |
Cu-DLP | Europe | EN 1758 |
Cu-DLP | International | ISO/R 1430 |
C12000 | USA | UNS |
C12000 | USA | ASME SB-111 |
C12000 | USA | ASME SB-359 |
C12000 | USA | ASME SB-395 |
C12000 | USA | ASME SB-42 |
C12000 | USA | ASME SB-75 |
C12000 | USA | ASTM B 111 |
C12000 | USA | ASTM B 152 |
C12000 | USA | ASTM B 188 |
DLP | USA | ASTM B 224 |
C12000 | USA | ASTM B 280 |
C12000 | USA | ASTM B 302 |
C12000 | USA | ASTM B 359 |
C12000 | USA | ASTM B 360 |
C12000 | USA | ASTM B 372 |
C12000 | USA | ASTM B 395 |
C12000 | USA | ASTM B 42 |
C12000 | USA | ASTM B 447 |
DLP | USA | ASTM B 5 |
C12000 | USA | ASTM B 640 |
C12000 | USA | ASTM B 68 |
C12000 | USA | ASTM B 687 |
DLP | USA | ASTM B 698 |
C12000 | USA | ASTM B 716 |
C12000 | USA | ASTM B 743 |
C12000 | USA | ASTM B 75 |
C12000 | USA | MIL MIL-B-18907 |
C12000 | USA | MIL MIL-T-24107 |
C12000 | USA | SAE J 461 |
C12000 | USA | SAE J 463 |
SW-Cu (2.0076) | Germany | DIN 1708 |
SW-Cu (2.0076) | Germany | DIN 1787 |
Producer/Supplier/Trade names
Tradename | Supplier |
---|---|
220 | William Prym Holding GmbH, Stolberg |
SW-Cu | MGI GmbH, Olpe |
SW-Cu | CSN Carl Schreiber GmbH, Neunkirchen |
SW-Cu | Wieland-Werke AG, Velbert |
SW-Cu | Wieland Prometa GmbH, Düsseldorf |
SW.Cu | KME Germany AG & Co.KG, Osnabrück |
Material Compliance
REACh | RoHS |
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Cu-DLP (CW023A; DIN EN 12163 : 1998-04)
Linear-elastic
Temperature [°C] | Young's modulus [GPa] | Poisson's ratio |
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Yield strength
Temperature [°C] | 0.2% Proof strength [MPa] |
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Electrical resistivity
Temperature [°C] | Specific electrical resistance [µΩm] |
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Specific heat
Temperature [°C] | Specific heat [kJ/(kg*K)] |
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Density
Temperature [°C] | Density [g/cm³] |
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Tensile strength
Temperature [°C] | Tensile strength [MPa] |
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Thermal conductivity
Temperature [°C] | Thermal conductivity [W/(m*K)] |
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Classification
WIAM Material | Source description |
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Designation
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Cu-DLP (soft annealed (+A); 4mm; not specified)
Strain life
Temperature [°C] | Cyclic fatigue strength coefficient [MPa] | Cyclic fatigue strength exponent | Ductility coefficient [Pa] | Ductility exponent | Cyclic strength coefficient [MPa] | Cyclic strain hardening exponent | Young's modulus [GPa] |
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Classification
Treatment | Dimension [mm] | Failure criteria | Source description |
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Cu-DLP (soft annealed (+A); 6.35mm; not specified)
Strain life
Temperature [°C] | Cyclic fatigue strength coefficient [MPa] | Cyclic fatigue strength exponent | Ductility coefficient [Pa] | Ductility exponent | Cyclic strength coefficient [MPa] | Cyclic strain hardening exponent | Young's modulus [GPa] |
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blur | blur | blur | blur | blur | blur | blur | blur |
Classification
Treatment | Dimension [mm] | Failure criteria | Source description |
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Cu-DLP (soft annealed (+A); rod; 2.000-80.000mm)
Yield strength
Temperature [°C] | 0.2% Proof strength [MPa] |
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blur | blur |
Tensile strength
Temperature [°C] | Tensile strength [MPa] |
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blur | blur |
Classification
Treatment | Semi-finished product | Dimension [mm] | Source description |
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blur | blur | blur | blur |
Cu-DLP (R250; rod; 2.000-10.000mm)
Yield strength
Temperature [°C] | 0.2% Proof strength [MPa] |
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blur | blur |
Tensile strength
Temperature [°C] | Tensile strength [MPa] |
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blur | blur |
Classification
Treatment | Semi-finished product | Dimension [mm] | Source description |
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blur | blur | blur | blur |
Cu-DLP (R250; rod; 10.000-30.000mm)
Yield strength
Temperature [°C] | 0.2% Proof strength [MPa] |
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blur | blur |
Tensile strength
Temperature [°C] | Tensile strength [MPa] |
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blur | blur |
Classification
Treatment | Semi-finished product | Dimension [mm] | Source description |
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blur | blur | blur | blur |
Cu-DLP (R230; rod; 30.000-80.000mm)
Yield strength
Temperature [°C] | 0.2% Proof strength [MPa] |
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blur | blur |
Tensile strength
Temperature [°C] | Tensile strength [MPa] |
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blur | blur |
Classification
Treatment | Semi-finished product | Dimension [mm] | Source description |
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blur | blur | blur | blur |
Cu-DLP (R300; rod; 2.000-20.000mm)
Yield strength
Temperature [°C] | 0.2% Proof strength [MPa] |
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blur | blur |
Tensile strength
Temperature [°C] | Tensile strength [MPa] |
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blur | blur |
Classification
Treatment | Semi-finished product | Dimension [mm] | Source description |
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blur | blur | blur | blur |
Cu-DLP (R280; rod; 20.000-40.000mm)
Yield strength
Temperature [°C] | 0.2% Proof strength [MPa] |
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blur | blur |
Tensile strength
Temperature [°C] | Tensile strength [MPa] |
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blur | blur |
Classification
Treatment | Semi-finished product | Dimension [mm] | Source description |
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blur | blur | blur | blur |
Cu-DLP (R260; rod; 40.000-80.000mm)
Yield strength
Temperature [°C] | 0.2% Proof strength [MPa] |
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blur | blur |
Tensile strength
Temperature [°C] | Tensile strength [MPa] |
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blur | blur |
Classification
Treatment | Semi-finished product | Dimension [mm] | Source description |
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blur | blur | blur | blur |
Cu-DLP (R350; rod; 2.000-10.000mm)
Yield strength
Temperature [°C] | 0.2% Proof strength [MPa] |
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blur | blur |
Tensile strength
Temperature [°C] | Tensile strength [MPa] |
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blur | blur |
Classification
Treatment | Semi-finished product | Dimension [mm] | Source description |
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blur | blur | blur | blur |